Laser drilling microvias request quote microvias are becoming more and more common in the board designs of today. Design guide for high density interconnects hdi and. Using laser ablation, the microvia spans a single dielectric and. Control units for cars, consumer and communicationselectronics, industrial electronics. This considered three density levels, where level a represented the largest footprint and level c the smallest. Hdi high density interconnect pcbs ttm technologies, inc. The hdi handbook includes a packaging technology map page 53, which can be used to indicate if a design can be implemented using traditional mechanical drilling, or if it is likely to need to use a high density interconnect hdi structure. For this reason, mlt has developed laser microvia processes to work with a.
Once you decide that hdi is going to play a role in your next board design, the first thing to do is become familiar with the basics, especially ipc hdi standards and guidelines. Pcb basic design rules 102019 multi circuit boards. Hdi high density interconnect pcbs hdi pcbs capitalize on the latest technologies available to increase the functionality of pcbs using the same or less amount of area. The following guidelines are provided as assessment criteria for the attachment technology process. Ipc2226, sectional design standard for high density interconnect hdi printed boards. The purpose is to educate the circuit user on thin film high density interconnects hdi and the benefits of design performance. With five factories and an interconnect technology lab in china, multek enables customers success globally and in a variety of product applications. Review the microvia capabilities of your cad system. The wiring capabilities of a welldesigned hdi 4 layer pcb can achieve the same or better functions as that of a standard 8 layer pcb. The copper pour is to use the idle space on the pcb as the reference surface, and then filled with solid copper. This zynq7000 soc pcb design guide, part of an overall set of. Design guide for high density interconnects hdi and microvias 1 scope this document describes various via formations, materials, and design guidelines used in high density interconnects hdi and microvias. In general, hdi pcbs are defined as pcbs with one or all of the following.
Quickturn hdi pcb prototype manufacturing in the usa. As a result, pcb design rules and production processes have evolved to achieve new layouts and capabilities. Microvia aspect ratio in pcb design advanced pcb design. As you can see from the arrow, we would drill one core and then lamanate them together andand then lamanate them together and then drill again. By using hdi technology we are able to produce printed circuit boards of highest complexity a process that would not be feasible by applying conventional multilayer production. The characteristics of these materials are found in section 5. Recommendations and guidelines will be offered for minimizing the effects of plating defects on reliability of microvias, and enabling improvement of hdi board design and process control. Calce webinar qualification and reliability of microvias.
Tolerances and design limits pattern tolerances tolerance drilling pth to conductive pattern outer layers 0,10mm drilling pth to conductive pattern inner layers 0,15mm drilling pth to milling pattern contour 0,10mm. The microvia need far less space as compared to other vias on the board. Whats different in hdi design three 3 new principles. For the interviewer who knows how to answer this, it cant bring him much fresh. Some pros and cons about pcb copper pour king sun pcb. It helps to understand that microvias may consist of blind or buried vias but with a different method of construction.
From telecommunications, mobile, wearables, and computing to automotive, medical, aerospace, and industrials, multek is. Survival is not mandatory by steve williams flexible circuit technology fourth edition by joseph fjelstad. Our weekly design enewsletter focuses on pcb design topics, including special columns and other unique editorial. Business business, international computers and office automation circuit printing design and construction economic aspects standards. Because the memory design is already very mature, the above design requirements can be seen in major forums, websites or related books. This will include new via shapes as well as the design rules that go along with them. Pwb design and fabrication higher density packages and pwb applications requirements are driving the need for highdensity interconnect design capabilities using microvias. Flextronics murad kurwa and jesus tan discuss the use of dfx processes for better dfa.
One of the rising stars in the pcb design world is the microvia, and im here. We are committed to providing complete solutions to our customers by resolving early design issues, shortening npi and production. In turn, an hdi pcb design gains smaller apertures and smaller pad sizes. There are specific design rules available from the individual packaging suppliers ex. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and structures for very high density assemblies. Ipc standards ipcjpca2315 and ipc2226 include formulae which can be used to calculate component and. They are also defined by the ipc in the hdi design standard, ipc2226. To use eagle for multilayer pcbs the design rules have to be setup rst.
Also, keep in mind that you do not want to subject the core to. Hdi high density interconnect is the present and future of pcb design. High speed design in altium designer altium designer 20. This guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules. Use blind vias, buried vias, or microvia techniques built. Ipc4104, specification for high density interconnect hdi and microvia. Advanced circuits offers expanded pcb manufacturing capabilities including laserdrilled microvias for hightech requirements. For an indepth 600 page look at high density interconnects and microvias, download the hdi handbook written. Our continuous investment in developing worldclass fineline microvia technology systems helps us maintain our position as a leading complex hdi manufacturer in china. Impact of microvia inpad design on void formation frank grano, felix bruno huntsville, al. Therefore, your cad system must be capable of handling blind and buried microvias as well.
The criteria for quality microvia production are no more than 50 defective microvias per million microvias and a covariance of the standard deviations of the daisy chain kelvin resistances coupons of 5%. Hdi is more expensive process, but overall product cost can be lower thanks to fewer layers and smaller boards. Hdi pcbs requires close teamwork and attention to specific dfm rules that apply to the project. These design rules apply to the bu and sbu interconnects using materials defined in ipcjpca4104. Having an incomplete plan for what the hdi boards should do and what components it needs will slow down the process. Confessions of a pcb designer anatomy of a via medium. It boils down to the use of microvias and all of the attendant requirements. If questions persist about design rules, electrical performance, or reliability, then consider creating a simple test vehicle. Published jointly with the japan printed circuits association. Effects of voiding on the degradation of microvias in high density interconnect printed circuit boards under thermomechanical stresses.
Circuit boards are built in cores so the easiest way to do blind vias is to do sequential lamanation. Resolve all your workaday questions with the pcb answer book. Dec 16, 2017 for most of us, is difficult to use or design hdi mircrovia pcb board, right now, electronic device become smaller and thinner, request designer to use limit pcb area to fill more electronic. I will share some experience with you here, and i hope it will benefit you. Dec 27, 2017 copper pour is an important part of pcb design. They cant sing or dance, but they can save you tons of space on your boards, and drastically reduce emi. Four or more layer pcb design for beginners using eagle. Are you meeting the design guidelines for microvia aspect ratio. Consider new layer stackups that allow the elimination of th vias. Hdi pcb design seminar cancelledthis 1 day hdi pcb design seminar examines advanced engineering and design techniques for the interconnection of area array components from asic packaging, portable products, high performance computing, and telecom to dense multichip modules. Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in. High density interconnect hdi and microvia technologies. This weekly newsletter features content focused on the manufacture of flexible printed circuits. Whats good about hdi via structures check out the spb16.
Careful planning and consideration into the design and manufacturing process are crucial to ensuring exactly what you need is the result. For example, solder paste inspection spi has undergone a shift from 2d to 3d because the 2d inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. One of the rising stars in the pcb design world is the microvia, and im here to remind you of what they are and all the fantastic things they can do. Jan 15, 2009 if questions persist about design rules, electrical performance, or reliability, then consider creating a simple test vehicle. Design features of high density pwb printed wiring boards. It is a set of rules and guidelines targeting a specific phase of manufacturing like design for. Microvia structures, how to reduce layers with channels, creating boulevards to increase routing density. The highdensity interconnect hdi market is projected to grow at a cagr of 12. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules. Pdf effects of voiding on the degradation of microvias in. With that in mind, you can estimate the maximum stub length in inches using the following equation. Hdi or mft boards can be produced with smaller tolerances.
A method will be provided to determine the likelihood of delamination due to eletroless copper bonding. Microvias must replace th vias, not just used in addition to th vias. In 1997 they were developed for mass production for the nascent mobile phone industry. You should never depend on them to signoff the final design. Agenda webinar hdi microvia technology cost aspects reasons for the use of hdi technology printed circuit board pcb size number of layers stackup and complexity other important cost influences design rules drilling costs microvia filling. Everything you need to know about micro via pcb design. Schweizer electronic ag leading producer of pcbs in europe. Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, coombs printed circuits handbook, fifth edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. Microvias hdi pcbs are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board. Hdi officially refers to any vias and via pads with diameters of 6 mils 0. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures. Just like standard pcb designs, hdi boards have four main concerns.
Hdi high density interconnection circuit boards and microvia hdi technology are inextricably linked. Reliability of pwb microvias for high density package. According to the ipc2221aipc2222 design guidelines a maximum aspect ratio of 6. The default view under my account billing invoices may not display all open invoices available for payment.
More highdensity interconnect hdi improvements including the tuning of the autorouter allegro pcb router specctra to use the via patterns, alignment of via list priority with allegro pcb editor, and creation and removal of antiacid bars are available in the 16. Pcb vias an overview bert simonovichs design notes. Day 2 high density design strategies using hdi for your products. Everything you need to know about micro via pcb design techniques. Microvias are used as the interconnects between layers in high density interconnect hdi. A stacked microvia is usually filled with electroplated copper to make electrical interconnections between multiple hdi layers and provide structural support for the outer levels of the microvia or for a component mounted on the outermost copper pad. This is an overview of hdi and provides models for estimation design density.
High density interconnect hdi and microvia technologies are the pwb industrys current manufacturing challenge. Design guide for high density interconnects hdi and microvias. Ipc issues call for papers for third annual ipc high. Because elic uses stacked copperfilled microvias for the.
There are three 3 new principles for hdimicrovia design that dont exist in th design. Micro vias are the remarkable component of high density interconnect boards. Hdi cost aspects seite 2 1 july, 2014 stefan keller. The difficulty is selecting the right microvia hdi structure. Differing requirements of the customer must be explicitly agreed. Thin film highdensity interconnect hdi design guidelines. Abstract reliability of microvia has been a concern since microvias were introduced to our industry. Assembly may take place downstream, but good dfa techniques can save your company time and money. The new ipc hdi design document, ipc2315 design guide for high density interconnect structures and microvias is a remarkable document developed over the last two years. In essence when choosing to design an hdi board it should be a planned use of hdi technology not just used as a last resort because a designer failed to route the circuit on a conventional board.
Pcb design, fabrication and use from the milaero enduser. This features the use of extremely thin tracks and tiny vias called microvias. Hdi printed circuit boards high density interconnect pcb. There are many benefits to laser drilling microvias, including real estate savings, impedance control, circuit reliability, and rf line termination. Theres a lot that you will need to do in the tools to efficiently work with the details of microvia design. Rules of thumb, in general, are no substitute for actual modeling and simulation. Careful planning and knowledge of the procedures involved in building the board is necessary to take full advantages of hdi and microvia technology. Increase the integration density of pcb by filling blind microvia and through holesusing electrolytic copper deposition. Today, smaller tracks and multilayer boards are commonplace in massproduced pcbs such designs would have been unheard of years ago. Hdi quality and acceptability requirements pcb design.
Hdi pcbs are circuit boards designed to maximize the density of. Oct 30, 2018 when we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. The best that can be done with thp is to use suitable trackandspace trackandgap layout rules to try achieve a. Multek is one of the first companies to provide volume hdi capability to our global customers. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and. Design rules for hdi pcbs ilfa feinstleiter technologie. A recommended hdi planning process to add the the general pcb design process. Home pcb design everything you need to know about micro via pcb design techniques. This advancement in pcb technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. Products purchased from third party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in material square inches and layer count more significantly. Due to their small size, designers prefer micro vias and use them in hdi boards. In the october issue of the pcb design magazine, our contributors and columnists explore the world of designing for assembly. Once you are set up with your manufacturer, your next step will be to configure your pcb design tools for working with microvias. Chapter1 introduction about this guide this guide provides information on pcb design for the zynq7000 soc, with a focus on strategies for making design decisions at the pcb and interface level. Ipc2226 design standard for high density interconnect hdi printed boards 1 scope this standard establishes requirements and considerations for the design of organic and inorganic high density interconnect hdi printed boards and its forms of component mounting and interconnecting structures. It is very difficult ult to change the design and parts once the board is already being made.
Microvia technology is now well established for use in commercial applications by means of published books, book chapters, industry guidelines, and specifications on this subject. The most complete and widely used guide to printed circuits, now updated and thoroughly revisedthe printed circuits handbook has served as the definitive source for coverage of every facet of printed circuit. These are a special type of vias having size 150 micrometers or less. To establish the design rules and hdi design methodology, consider the redesign of an existing highdensity th board using the advice in chapter 3 hdi design. Whether it is made by chinese pcb design software or some foreign protel, powerpcb provides intelligent copper pour function. Blind microvias open up routing channels on the inner layers. It is provided in 2, 4, 6, 10, 12, 18, 24 and 36 layer structures with high and low density design rules, 5. One exciting and relatively recent circuit board development is that of high density interconnect hdi. This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material. Multek is a valueadded manufacturer of rigid, flexible and rigidflex printed circuits, and offers printed electronics.
I feel that if i want to prove that i am a senior, experienced and experienced pcb design engineer, i have to blow down. The use of microvias, blind or buried, helps to reduce the number of layers. For most of us, is difficult to use or design hdi mircrovia pcb board, right now, electronic device become smaller and thinner, request designer to use limit pcb area to fill more electronic. Aug 28, 2018 cawthorne moved on to a discussion of surface mount design rules, beginning with component footprints for which the defining standard was ipc7351. High density interconnection hdi technology enables a miniaturization of the printed circuit board in close connection with the laser via technology. The progressive miniaturization of electronic circuits increasingly requires the use of hdi circuit boards with copperfilled blind microvias. Fyi new book available happy holden, hdi techniques, free.
This paper is intended to be a comprehensive roadmap of the design process, with a focus on the selection of materials, films, and extensive range of options. This study was designed to understand the reliability of type 1, type 2, and type 3 microvias. We will not provide pad diameters, trace widths, spacing, etc. One of the rising stars in the pcb design world is the microvia, and im here to remind you of what they are. Hdi routing challenges and tips advanced pcb design blog. Finepitch and highio bga design rules, layer assignment, and routing.
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