In general, hdi pcbs are defined as pcbs with one or all of the following. In 1997 they were developed for mass production for the nascent mobile phone industry. The characteristics of these materials are found in section 5. The difficulty is selecting the right microvia hdi structure. There are many benefits to laser drilling microvias, including real estate savings, impedance control, circuit reliability, and rf line termination. By using hdi technology we are able to produce printed circuit boards of highest complexity a process that would not be feasible by applying conventional multilayer production. For example, solder paste inspection spi has undergone a shift from 2d to 3d because the 2d inspection technologies manufacturers traditionally used to collect solder deposit images could not solve shadowing problems. The default view under my account billing invoices may not display all open invoices available for payment. Design rules for hdi pcbs ilfa feinstleiter technologie. A recommended hdi planning process to add the the general pcb design process. High density interconnect hdi and microvia technologies. Jan 15, 2009 if questions persist about design rules, electrical performance, or reliability, then consider creating a simple test vehicle. Once you decide that hdi is going to play a role in your next board design, the first thing to do is become familiar with the basics, especially ipc hdi standards and guidelines.
The best that can be done with thp is to use suitable trackandspace trackandgap layout rules to try achieve a. Hdi pcbs are circuit boards designed to maximize the density of. This will include new via shapes as well as the design rules that go along with them. Agenda webinar hdi microvia technology cost aspects reasons for the use of hdi technology printed circuit board pcb size number of layers stackup and complexity other important cost influences design rules drilling costs microvia filling. Microvias are used as the interconnects between layers in high density interconnect hdi.
Microvia technology is now well established for use in commercial applications by means of published books, book chapters, industry guidelines, and specifications on this subject. Pcb design, fabrication and use from the milaero enduser. Ipc standards ipcjpca2315 and ipc2226 include formulae which can be used to calculate component and. You should never depend on them to signoff the final design. Everything you need to know about micro via pcb design techniques. Some pros and cons about pcb copper pour king sun pcb. Hdi is more expensive process, but overall product cost can be lower thanks to fewer layers and smaller boards. The highdensity interconnect hdi market is projected to grow at a cagr of 12. This guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules. It is very difficult ult to change the design and parts once the board is already being made. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and. Hdi high density interconnection circuit boards and microvia hdi technology are inextricably linked. Published jointly with the japan printed circuits association.
I feel that if i want to prove that i am a senior, experienced and experienced pcb design engineer, i have to blow down. I will share some experience with you here, and i hope it will benefit you. This paper is intended to be a comprehensive roadmap of the design process, with a focus on the selection of materials, films, and extensive range of options. Are you meeting the design guidelines for microvia aspect ratio. Increase the integration density of pcb by filling blind microvia and through holesusing electrolytic copper deposition. Because the memory design is already very mature, the above design requirements can be seen in major forums, websites or related books. Ipc issues call for papers for third annual ipc high. If questions persist about design rules, electrical performance, or reliability, then consider creating a simple test vehicle. For the interviewer who knows how to answer this, it cant bring him much fresh. Fyi new book available happy holden, hdi techniques, free.
Hdi printed circuit boards high density interconnect pcb. These design rules apply to the bu and sbu interconnects using materials defined in ipcjpca4104. Hdi routing challenges and tips advanced pcb design blog. Four or more layer pcb design for beginners using eagle. Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, coombs printed circuits handbook, fifth edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. Whether it is made by chinese pcb design software or some foreign protel, powerpcb provides intelligent copper pour function. We are committed to providing complete solutions to our customers by resolving early design issues, shortening npi and production. To use eagle for multilayer pcbs the design rules have to be setup rst. The following guidelines are provided as assessment criteria for the attachment technology process. Just like standard pcb designs, hdi boards have four main concerns. Theres a lot that you will need to do in the tools to efficiently work with the details of microvia design. Everything you need to know about micro via pcb design.
This weekly newsletter features content focused on the manufacture of flexible printed circuits. Control units for cars, consumer and communicationselectronics, industrial electronics. Multek is a valueadded manufacturer of rigid, flexible and rigidflex printed circuits, and offers printed electronics. Calce webinar qualification and reliability of microvias. For an indepth 600 page look at high density interconnects and microvias, download the hdi handbook written. Products purchased from third party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
Hdi cost aspects seite 2 1 july, 2014 stefan keller. Business business, international computers and office automation circuit printing design and construction economic aspects standards. Design features of high density pwb printed wiring boards. For this reason, mlt has developed laser microvia processes to work with a. It boils down to the use of microvias and all of the attendant requirements. Once you are set up with your manufacturer, your next step will be to configure your pcb design tools for working with microvias. The microvia need far less space as compared to other vias on the board. Recommendations and guidelines will be offered for minimizing the effects of plating defects on reliability of microvias, and enabling improvement of hdi board design and process control.
Resolve all your workaday questions with the pcb answer book. There are specific design rules available from the individual packaging suppliers ex. Having an incomplete plan for what the hdi boards should do and what components it needs will slow down the process. With five factories and an interconnect technology lab in china, multek enables customers success globally and in a variety of product applications. Pdf effects of voiding on the degradation of microvias in. Hdi or mft boards can be produced with smaller tolerances. As a result, pcb design rules and production processes have evolved to achieve new layouts and capabilities. Advanced circuits offers expanded pcb manufacturing capabilities including laserdrilled microvias for hightech requirements. More highdensity interconnect hdi improvements including the tuning of the autorouter allegro pcb router specctra to use the via patterns, alignment of via list priority with allegro pcb editor, and creation and removal of antiacid bars are available in the 16. The criteria for quality microvia production are no more than 50 defective microvias per million microvias and a covariance of the standard deviations of the daisy chain kelvin resistances coupons of 5%. Microvia structures, how to reduce layers with channels, creating boulevards to increase routing density. They cant sing or dance, but they can save you tons of space on your boards, and drastically reduce emi. One of the rising stars in the pcb design world is the microvia, and im here to remind you of what they are and all the fantastic things they can do. Also, keep in mind that you do not want to subject the core to.
In the october issue of the pcb design magazine, our contributors and columnists explore the world of designing for assembly. Rules of thumb, in general, are no substitute for actual modeling and simulation. Ipc2226, sectional design standard for high density interconnect hdi printed boards. Hdi pcb design seminar cancelledthis 1 day hdi pcb design seminar examines advanced engineering and design techniques for the interconnection of area array components from asic packaging, portable products, high performance computing, and telecom to dense multichip modules. Pwb design and fabrication higher density packages and pwb applications requirements are driving the need for highdensity interconnect design capabilities using microvias. In essence when choosing to design an hdi board it should be a planned use of hdi technology not just used as a last resort because a designer failed to route the circuit on a conventional board. Design guide for high density interconnects hdi and. The copper pour is to use the idle space on the pcb as the reference surface, and then filled with solid copper. A method will be provided to determine the likelihood of delamination due to eletroless copper bonding. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules. Home pcb design everything you need to know about micro via pcb design techniques.
These are a special type of vias having size 150 micrometers or less. There are three 3 new principles for hdimicrovia design that dont exist in th design. It is a departure from traditional ipc documents in that it carries in it a lengthy tutorial on how to calculate and select the proper design rules and structures for very high density assemblies. One of the rising stars in the pcb design world is the microvia, and im here to remind you of what they are. Impact of microvia inpad design on void formation frank grano, felix bruno huntsville, al. Multek is one of the first companies to provide volume hdi capability to our global customers. Hdi high density interconnect is the present and future of pcb design. Hdi design selection guideline this guideline provides an easy to follow tutorial on the selection of hdi and microvia design rules and structures.
Survival is not mandatory by steve williams flexible circuit technology fourth edition by joseph fjelstad. A stacked microvia is usually filled with electroplated copper to make electrical interconnections between multiple hdi layers and provide structural support for the outer levels of the microvia or for a component mounted on the outermost copper pad. Use blind vias, buried vias, or microvia techniques built. The most complete and widely used guide to printed circuits, now updated and thoroughly revisedthe printed circuits handbook has served as the definitive source for coverage of every facet of printed circuit. The use of microvias, blind or buried, helps to reduce the number of layers.
Pcb basic design rules 102019 multi circuit boards. Blind microvias open up routing channels on the inner layers. Chapter1 introduction about this guide this guide provides information on pcb design for the zynq7000 soc, with a focus on strategies for making design decisions at the pcb and interface level. This features the use of extremely thin tracks and tiny vias called microvias. Oct 30, 2018 when we look at the optical inspection market growth trajectory, we can see how process challenges helped create innovations. Because elic uses stacked copperfilled microvias for the.
The progressive miniaturization of electronic circuits increasingly requires the use of hdi circuit boards with copperfilled blind microvias. Confessions of a pcb designer anatomy of a via medium. Design guide for high density interconnects hdi and microvias 1 scope this document describes various via formations, materials, and design guidelines used in high density interconnects hdi and microvias. Pcb vias an overview bert simonovichs design notes. Reliability of pwb microvias for high density package. Assembly may take place downstream, but good dfa techniques can save your company time and money. Day 2 high density design strategies using hdi for your products. Micro vias are the remarkable component of high density interconnect boards.
Whats good about hdi via structures check out the spb16. It helps to understand that microvias may consist of blind or buried vias but with a different method of construction. Hdi quality and acceptability requirements pcb design. This is an overview of hdi and provides models for estimation design density. Schweizer electronic ag leading producer of pcbs in europe. Review the microvia capabilities of your cad system. Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in material square inches and layer count more significantly. Careful planning and knowledge of the procedures involved in building the board is necessary to take full advantages of hdi and microvia technology. Hdi high density interconnect pcbs ttm technologies, inc. Laser drilling microvias request quote microvias are becoming more and more common in the board designs of today. Due to their small size, designers prefer micro vias and use them in hdi boards. High density interconnection hdi technology enables a miniaturization of the printed circuit board in close connection with the laser via technology.
For most of us, is difficult to use or design hdi mircrovia pcb board, right now, electronic device become smaller and thinner, request designer to use limit pcb area to fill more electronic. The purpose is to educate the circuit user on thin film high density interconnects hdi and the benefits of design performance. One exciting and relatively recent circuit board development is that of high density interconnect hdi. Careful planning and consideration into the design and manufacturing process are crucial to ensuring exactly what you need is the result. This technology is required when high io area array packages with lower than 0.
According to the ipc2221aipc2222 design guidelines a maximum aspect ratio of 6. It is a set of rules and guidelines targeting a specific phase of manufacturing like design for. Flextronics murad kurwa and jesus tan discuss the use of dfx processes for better dfa. Microvias hdi pcbs are minute holes drilled by a laser to generate the electrical connection between the layers in a multilayer circuit board. Circuit boards are built in cores so the easiest way to do blind vias is to do sequential lamanation. This study was designed to understand the reliability of type 1, type 2, and type 3 microvias. As you can see from the arrow, we would drill one core and then lamanate them together andand then lamanate them together and then drill again. Today, smaller tracks and multilayer boards are commonplace in massproduced pcbs such designs would have been unheard of years ago. Mar 03, 2020 the recent advances in pcb design systems and technology have had sweeping effects across the industry.
Ipc2226 design standard for high density interconnect hdi printed boards 1 scope this standard establishes requirements and considerations for the design of organic and inorganic high density interconnect hdi printed boards and its forms of component mounting and interconnecting structures. This considered three density levels, where level a represented the largest footprint and level c the smallest. Effects of voiding on the degradation of microvias in high density interconnect printed circuit boards under thermomechanical stresses. One of the rising stars in the pcb design world is the microvia, and im here. The new ipc hdi design document, ipc2315 design guide for high density interconnect structures and microvias is a remarkable document developed over the last two years. Microvias must replace th vias, not just used in addition to th vias. High density interconnect hdi and microvia technologies are the pwb industrys current manufacturing challenge.
We will not provide pad diameters, trace widths, spacing, etc. To establish the design rules and hdi design methodology, consider the redesign of an existing highdensity th board using the advice in chapter 3 hdi design. Design guide for high density interconnects hdi and microvias. Tolerances and design limits pattern tolerances tolerance drilling pth to conductive pattern outer layers 0,10mm drilling pth to conductive pattern inner layers 0,15mm drilling pth to milling pattern contour 0,10mm. Quickturn hdi pcb prototype manufacturing in the usa.
Thin film highdensity interconnect hdi design guidelines. Differing requirements of the customer must be explicitly agreed. It is provided in 2, 4, 6, 10, 12, 18, 24 and 36 layer structures with high and low density design rules, 5. This advancement in pcb technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. Consider new layer stackups that allow the elimination of th vias. Although the microvia process increases the cost of the hdi pcb, the proper design and reduction in layer count reduces cost in. Ipc4104, specification for high density interconnect hdi and microvia. Our continuous investment in developing worldclass fineline microvia technology systems helps us maintain our position as a leading complex hdi manufacturer in china. Hdi officially refers to any vias and via pads with diameters of 6 mils 0. Our weekly design enewsletter focuses on pcb design topics, including special columns and other unique editorial. Therefore, your cad system must be capable of handling blind and buried microvias as well. The hdi handbook includes a packaging technology map page 53, which can be used to indicate if a design can be implemented using traditional mechanical drilling, or if it is likely to need to use a high density interconnect hdi structure. Hdi high density interconnect pcbs hdi pcbs capitalize on the latest technologies available to increase the functionality of pcbs using the same or less amount of area.
Microvia aspect ratio in pcb design advanced pcb design. This specification educates users in microvia formation, selection of wiring density, selection of design rules, interconnecting structures, and material. High speed design in altium designer altium designer 20. Hdi pcbs requires close teamwork and attention to specific dfm rules that apply to the project. They are also defined by the ipc in the hdi design standard, ipc2226. From telecommunications, mobile, wearables, and computing to automotive, medical, aerospace, and industrials, multek is. In turn, an hdi pcb design gains smaller apertures and smaller pad sizes. Finepitch and highio bga design rules, layer assignment, and routing.
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